---
title: "GlobalFoundries to make US silicon interposers for TSMC's CoWoS"
url: https://www.parallelquant.com/posts/globalfoundries-to-make-us-silicon-interposers-for-tsmc-s-cowos-8f18bf
source_name: "Tom's Hardware"
source_url: https://www.tomshardware.com/tech-industry/semiconductors/globalfoundries-to-produce-silicon-interposers-for-tsmcs-cowos-in-the-us-five-year-agreement-valued-at-usd2-billion
published: 2026-10-08T18:23:28.000Z
topics: ["chips"]
publisher: "Parallel Quant"
---

# GlobalFoundries to make US silicon interposers for TSMC's CoWoS

*2026-10-08 · Source: [Tom's Hardware](https://www.tomshardware.com/tech-industry/semiconductors/globalfoundries-to-produce-silicon-interposers-for-tsmcs-cowos-in-the-us-five-year-agreement-valued-at-usd2-billion)*

GlobalFoundries signed a five-year, $2 billion agreement to join TSMC's CoWoS advanced-packaging supply chain in the US. It will help produce interposers for AI and HPC accelerators without investing in leading-edge process nodes.

**Why it matters:** Advanced packaging has been a key bottleneck for AI accelerators, and adding US capacity diversifies supply beyond Taiwan. It also shows trailing-edge fabs can find a role in the AI buildout, alongside record data center construction spending.

**Topics:** chips

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Read the original: https://www.tomshardware.com/tech-industry/semiconductors/globalfoundries-to-produce-silicon-interposers-for-tsmcs-cowos-in-the-us-five-year-agreement-valued-at-usd2-billion
Canonical: https://www.parallelquant.com/posts/globalfoundries-to-make-us-silicon-interposers-for-tsmc-s-cowos-8f18bf
Published by Parallel Quant — https://www.parallelquant.com