---
title: "Samsung and Broadcom announce chip partnership worth over $200B by 2030"
url: https://www.parallelquant.com/posts/samsung-and-broadcom-announce-chip-partnership-worth-over-200b-by-2030-139653
source_name: "Data Center Dynamics"
source_url: https://www.datacenterdynamics.com/en/news/samsung-and-broadcom-announce-plans-to-collaborate-across-memory-foundry-and-packaging-technologies/
published: 2026-07-27T14:45:59.000Z
topics: ["chips"]
publisher: "Parallel Quant"
---

# Samsung and Broadcom announce chip partnership worth over $200B by 2030

*2026-07-27 · Source: [Data Center Dynamics](https://www.datacenterdynamics.com/en/news/samsung-and-broadcom-announce-plans-to-collaborate-across-memory-foundry-and-packaging-technologies/)*

Samsung and Broadcom announced plans to collaborate across memory, foundry, and advanced packaging technologies. The companies estimate the partnership will be worth more than $200 billion by the end of the decade.

**Why it matters:** This pairs Samsung's manufacturing and memory capacity with Broadcom's chip design and custom silicon business, positioning both to better compete with TSMC and Nvidia for AI chip production and packaging capacity as demand for advanced nodes and HBM memory keeps surging.

**Topics:** chips

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Read the original: https://www.datacenterdynamics.com/en/news/samsung-and-broadcom-announce-plans-to-collaborate-across-memory-foundry-and-packaging-technologies/
Canonical: https://www.parallelquant.com/posts/samsung-and-broadcom-announce-chip-partnership-worth-over-200b-by-2030-139653
Published by Parallel Quant — https://www.parallelquant.com