---
title: "TSMC, Samsung, Intel back larger photomasks for next-gen lithography"
url: https://www.parallelquant.com/posts/tsmc-samsung-intel-back-larger-photomasks-for-next-gen-lithography-a71f04
source_name: "Tom's Hardware"
source_url: https://www.tomshardware.com/tech-industry/semiconductors/tsmc-samsung-and-intel-shore-up-support-with-asml-to-deploy-larger-high-na-euv-photomasks-6-12-inch-photomask-transition-may-take-years-despite-unified-effort
published: 2026-09-10T11:20:00.000Z
topics: ["chips"]
publisher: "Parallel Quant"
---

# TSMC, Samsung, Intel back larger photomasks for next-gen lithography

*2026-09-10 · Source: [Tom's Hardware](https://www.tomshardware.com/tech-industry/semiconductors/tsmc-samsung-and-intel-shore-up-support-with-asml-to-deploy-larger-high-na-euv-photomasks-6-12-inch-photomask-transition-may-take-years-despite-unified-effort)*

TSMC, Samsung, and Intel are jointly supporting ASML's development of larger 6x12-inch photomasks for High-NA EUV lithography systems. The larger format would let chipmakers build big processors without stitching multiple exposures together, though the transition is expected to take years.

**Why it matters:** Getting the industry's three biggest foundry rivals to align on a shared photomask standard reduces fragmentation risk for ASML's roadmap and speeds adoption. Stitching-free large-die manufacturing matters directly for AI accelerators, which are already pushing die sizes toward the reticle limit.

**Topics:** chips

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Read the original: https://www.tomshardware.com/tech-industry/semiconductors/tsmc-samsung-and-intel-shore-up-support-with-asml-to-deploy-larger-high-na-euv-photomasks-6-12-inch-photomask-transition-may-take-years-despite-unified-effort
Canonical: https://www.parallelquant.com/posts/tsmc-samsung-intel-back-larger-photomasks-for-next-gen-lithography-a71f04
Published by Parallel Quant — https://www.parallelquant.com