China's CXMT targets 30% of global DRAM market by 2030

ChangXin Memory Technologies (CXMT) is planning a sixth DRAM fab in China to expand memory production, aiming to more than double capacity in the medium term if all announced projects proceed. The company's longer-term plans remain bottlenecked by restricted access to advanced chipmaking tools.

Why it matters: Memory chips (DRAM/HBM) are a critical bottleneck for AI accelerators, and a serious Chinese push to capture a third of the global DRAM market would cut China's dependence on Samsung, SK hynix, and Micron — directly relevant to the ongoing export-control disputes over advanced lithography tools.