Google reportedly picks Intel packaging over TSMC for next TPU

Google has reportedly chosen Intel's EMIB-T packaging technology over TSMC's CoWoS-L for its next-generation Tensor Processing Unit, codenamed Humufish. The move highlights Intel's packaging business as an alternative to TSMC's constrained CoWoS capacity.

Why it matters: It could reshape the advanced chip-packaging supply chain that AI accelerators depend on.