TSMC, Samsung, Intel back larger photomasks for next-gen lithography

TSMC, Samsung, and Intel are jointly supporting ASML's development of larger 6x12-inch photomasks for High-NA EUV lithography systems. The larger format would let chipmakers build big processors without stitching multiple exposures together, though the transition is expected to take years.

Why it matters: Getting the industry's three biggest foundry rivals to align on a shared photomask standard reduces fragmentation risk for ASML's roadmap and speeds adoption. Stitching-free large-die manufacturing matters directly for AI accelerators, which are already pushing die sizes toward the reticle limit.