GlobalFoundries to make US silicon interposers for TSMC's CoWoS

GlobalFoundries signed a five-year, $2 billion agreement to join TSMC's CoWoS advanced-packaging supply chain in the US. It will help produce interposers for AI and HPC accelerators without investing in leading-edge process nodes.

Why it matters: Advanced packaging has been a key bottleneck for AI accelerators, and adding US capacity diversifies supply beyond Taiwan. It also shows trailing-edge fabs can find a role in the AI buildout, alongside record data center construction spending.